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Love Cleaning Machine×ゼビオス（XEVIOS CORP.,） - List of Manufacturers, Suppliers, Companies and Products

Love Cleaning Machine Product List

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Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)

Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

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LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device

LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device

A chemical cleaning device that enables the removal of contaminants, metal pollution, and transport and drying without touching the front and back surfaces of the workpiece! It also supports a combination with brush cleaning using chemicals.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

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1-chamber type liquid chemical spin scrub cleaning machine

1-chamber type liquid chemical spin scrub cleaning machine

Complete cleaning to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.

The "1-Chamber Type Liquid Spin Scrub Cleaning Machine" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical solutions, as well as contact cleaning methods like brushes. It completes the cleaning process and spin drying within a single chamber, contributing to space-saving design, which reduces installation space and costs. We can propose suitable equipment configurations based on various device configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemicals can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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